Resistivity of resistance strain gauge after chip placement and surface defect

During the use of the resistance strain gauge, there will be problems such as abnormal resistance and surface defects after patching. Convergence Science and Technology will summarize the problem of abnormal resistance and surface defects after the resistance strain gauge is applied.

First, the resistance value after the patch is abnormal

Under normal circumstances, the resistance strain gauge will have a small change or change in the resistance value after patching, but sometimes the user will reflect that the resistance value of the strain gauge will change greatly, which causes the following factors:

1. When the pressure is cured, the pressure is too large, resulting in abnormal resistance after the patch, and the pressure is appropriately reduced.

2. The pressure is not uniform during pressurization, which causes the strain gauge of the strain gauge to deform and the resistance value is abnormal. This problem is mainly caused by the non-standard pressure clamp and the uneven force of the strain gauge.

3. The radius of curvature of the tooling design does not coincide with the component, causing the strain gauge to deform or bulge and the resistance value is abnormal.

4. After using for a period of time, the resistance value is abnormal. This problem is mainly caused by bubbles or individual voids inside the strain gage or unreliable factors during welding.

In the actual use process, we should try to avoid the above problems and specify corresponding solutions in advance.

Second, the surface defects after the patch

The main defects of the resistance strain gauge after patching are void, drum package, uneven rubber layer, rubber layer, rubber edge, pressure pit, deformation, etc., in which the drum package and pressure pit can be used as long as they are not in the sensitive grid.

For these defects, it is necessary to perform the appearance inspection after the patch, and eliminate the defective one to ensure the quality of the patch. At the same time, the resistance and insulation resistance should be checked to avoid waste of the subsequent process.

Nanjing Juhang Technology Co., Ltd. will consult the details of the strain test process.

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